Measurement of deformation of solder joint during heating with speckle interferometry

Wei An; Torgny E. Carlsson

doi:10.1117/12.365759

13 October 1999 Measurement of deformation of solder joint during heating with speckle interferometry

Wei An, Torgny E. Carlsson

Proceedings Volume 3783, Optical Diagnostics for Fluids/Heat/Combustion and Photomechanics for Solids; (1999) https://doi.org/10.1117/12.365759
Event: SPIE's International Symposium on Optical Science, Engineering, and Instrumentation, 1999, Denver, CO, United States

Abstract

The heat expansion of the solder joint on a PCB board has been investigated using speckle interferometry. Set-ups for measuring in-plane and out-of-plane displacements have been separately used. The component was stepwise heated by increasing the working current. During the heating the temperature was measured by a thermocouple. For each step, the heating was halted until thermal equilibrium occurred, then four phase-shifted interferograms were recorded for each temperature T_n. In this way the deformation between two temperatures T_n+1 and T_n were evaluated. The deformation was measured in different directions and the joint solder's strains were calculated.

Citation Download Citation

Wei An and Torgny E. Carlsson "Measurement of deformation of solder joint during heating with speckle interferometry", Proc. SPIE 3783, Optical Diagnostics for Fluids/Heat/Combustion and Photomechanics for Solids, (13 October 1999); https://doi.org/10.1117/12.365759

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