Submicron patterning of aluminum films by laser ablation

David W. Doerr; Dennis R. Alexander

doi:10.1117/12.361248

30 August 1999 Submicron patterning of aluminum films by laser ablation

David W. Doerr, Dennis R. Alexander

Proceedings Volume 3874, Micromachining and Microfabrication Process Technology V; (1999) https://doi.org/10.1117/12.361248
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States

Abstract

Microfabrication of sub-micron holes on 30 nm thick aluminum films on fused silica was investigated using pulse durations form 300 fs to 6 ns at 400 nm wavelength. Micromachined areas were investigate using atomic force microscopy for quality and size of features produced. Ablation diameters less than 400 nm was achieved with all pulse widths. Pulses less than 5 ps removed the films cleanly and left a flat- bottomed crater with no evidence of substrate melting over a wide fluence range.

Citation Download Citation

David W. Doerr and Dennis R. Alexander "Submicron patterning of aluminum films by laser ablation", Proc. SPIE 3874, Micromachining and Microfabrication Process Technology V, (30 August 1999); https://doi.org/10.1117/12.361248

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