Paper
2 September 1999 Micromirror arrays fabricated by flip-chip assembly
M. Adrian Michalicek, Wenge Zhang, Kevin F. Harsh, Victor M. Bright, Y. C. Lee
Author Affiliations +
Proceedings Volume 3878, Miniaturized Systems with Micro-Optics and MEMS; (1999) https://doi.org/10.1117/12.361291
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
This paper presents the design, fabrication, modeling, and testing of several Flexure-Beam Micromirror Device (FBMD) arrays fabricated using flip-chip assembly. These arrays were prefabricated using a silicon surface-micromachining technology and then transferred to a ceramic receiving substrate using a thin layer of indium placed between the bond pads of the two chips. Device characterization was completed using an interferometric microscope in which micromirror deflection was determined as a function of address potential. The arrays demonstrate reasonable micromirror performance with optically flat surfaces measuring only 5 - 6 nm of variance across as much as a 150 micrometer mirror surface.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
M. Adrian Michalicek, Wenge Zhang, Kevin F. Harsh, Victor M. Bright, and Y. C. Lee "Micromirror arrays fabricated by flip-chip assembly", Proc. SPIE 3878, Miniaturized Systems with Micro-Optics and MEMS, (2 September 1999); https://doi.org/10.1117/12.361291
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CITATIONS
Cited by 10 scholarly publications and 15 patents.
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KEYWORDS
Micromirrors

Ceramics

Gold

Silicon

Indium

Mirrors

Electrodes

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