Applications of laser ablation to microengineering

Malcolm C. Gower; Nadeem Hasan Rizvi

doi:10.1117/12.407367

16 August 2000 Applications of laser ablation to microengineering

Proceedings Volume 4065, High-Power Laser Ablation III; (2000) https://doi.org/10.1117/12.407367
Event: High-Power Laser Ablation, 2000, Santa Fe, NM, United States

Abstract

Applications of pulsed laser ablation to the manufacture of micro- electro-mechanical systems (MEMS) and micro-opto-electro-mechanical systems (MOEMS) devices are presented. Laser ablative processes used to manufacture a variety of microsystems technology (MST) components in the computer peripheral, sensing and biomedical industries are described together with a view of some future developments.

Citation Download Citation

Malcolm C. Gower and Nadeem Hasan Rizvi "Applications of laser ablation to microengineering", Proc. SPIE 4065, High-Power Laser Ablation III, (16 August 2000); https://doi.org/10.1117/12.407367

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