Dependence of resist profile on exposed area ratio

Eishi Shiobara; Daisuke Kawamura; Kentaro Matsunaga; Yasunobu Onishi

doi:10.1117/12.436896

24 August 2001 Dependence of resist profile on exposed area ratio

Eishi Shiobara, Daisuke Kawamura, Kentaro Matsunaga, Yasunobu Onishi

Proceedings Volume 4345, Advances in Resist Technology and Processing XVIII; (2001) https://doi.org/10.1117/12.436896
Event: 26th Annual International Symposium on Microlithography, 2001, Santa Clara, CA, United States

Abstract

We investigated resist profile dependence on Exposed Area Ratio (EAR). Using high activation type chemically amplified positive resist, profile changed from T-top to rounded profile with increasing EAR. We thought that this profile change was caused by acid evaporation and re- sticking. To estimate the effect of re-sticking acid, we performed resist sandwich tests. We measured resist thickness loss after PEB and observed resist profile change caused by re-sticking acid. The results thereby obtained suggest the model we propose. To reduce acid evaporation and re-sticking, we tried to use an overcoat layer. The overcoat layer was found to reduce acid evaporation and be useful for reducing resist profile dependence on EAR.

Citation Download Citation

Eishi Shiobara, Daisuke Kawamura, Kentaro Matsunaga, and Yasunobu Onishi "Dependence of resist profile on exposed area ratio", Proc. SPIE 4345, Advances in Resist Technology and Processing XVIII, (24 August 2001); https://doi.org/10.1117/12.436896

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