Thermal-induced stress in dielectric membranes suitable for micromechanized gas sensors

J. Puigcorbe; A. Vila; Isabel Gracia; Carles Cane; Juan Ramon Morante

doi:10.1117/12.425339

5 April 2001 Thermal-induced stress in dielectric membranes suitable for micromechanized gas sensors

J. Puigcorbe, A. Vila, Isabel Gracia, Carles Cane, Juan Ramon Morante

Proceedings Volume 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001; (2001) https://doi.org/10.1117/12.425339
Event: Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, 2001, Cannes-Mandelieu, France

Abstract

A laboratory model of a gas sensor substrate produced in microelectronic technology has been experimentally analyzed and simulated by means of a 3D FEM model. This paper discusses its thermal and mechanical behavior under different working temperatures. The thermal expansion mismatch between different materials induces thermal stresses and structure deflection. Simulated and experimental results are proved to be in good agreement. Moreover, the proposed design offers low-power consumption, good thermal uniformity, low thermal inertia and mechanical stability up to 650 degrees Celsius.

Citation Download Citation

J. Puigcorbe, A. Vila, Isabel Gracia, Carles Cane, and Juan Ramon Morante "Thermal-induced stress in dielectric membranes suitable for micromechanized gas sensors", Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); https://doi.org/10.1117/12.425339

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