Paper
27 December 2001 Ion beam nanosmoothing of sapphire and silicon carbide surfaces
David B. Fenner, Vincent DiFilippo, Johnathan Bennett, Thomas Tetreault, James K. Hirvonen, Leonard C. Feldman
Author Affiliations +
Abstract
The surfaces of single-crystal wafers of sapphire and silicon carbide with microelectronic-grade high polish were exposed to a gas-cluster ion beam (GCIB) and significant reductions in roughness were observed. Atomic-force microscopy revealed that the typical initial surfaces consisted of a fine but small random roughness together with relatively large and sharp asperities. The latter were removed efficiently and GCIB smoothing process improvements are reported. The SiC wafers also have a high density of shallow scratch marks and these too were removed, with the average roughness Ra falling below 4 angstrom after the best process. Analysis of the SiC by Rutherford backscattering spectroscopy in channeling mode revealed that when the GCIB process was adjusted so that asperities and scratch marks were removed, there was no increase in near- and at-surface damage. In particular, no lattice damage was observed of the sort typically caused by ion implantation prior to annealing. Significantly, it was found that oxygen gas cluster ion beams provided superior results with SiC as compared with argon GCIB. Surface smoothing mechanisms are proposed to explain these results.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David B. Fenner, Vincent DiFilippo, Johnathan Bennett, Thomas Tetreault, James K. Hirvonen, and Leonard C. Feldman "Ion beam nanosmoothing of sapphire and silicon carbide surfaces", Proc. SPIE 4468, Engineering Thin Films with Ion Beams, Nanoscale Diagnostics, and Molecular Manufacturing, (27 December 2001); https://doi.org/10.1117/12.452556
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Cited by 8 scholarly publications.
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KEYWORDS
Silicon carbide

Semiconducting wafers

Argon

Ion beams

Oxygen

Ions

Silicon

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