Paper
29 May 2002 Experiment and simulation study of instability of a novel electrostatic MEMS relay
Cong-Shun Wang, Weibin Zhang, Chunyang Xiong, Jing Fang
Author Affiliations +
Proceedings Volume 4537, Third International Conference on Experimental Mechanics; (2002) https://doi.org/10.1117/12.468762
Event: Third International Conference on Experimental Mechanics, 2002, Beijing, China
Abstract
In this paper, the mechanical-electronic behavior of a bulk- micromachined relay driven by electrostatic actuator for lateral movement, is experimentally studied and simulated. Due to the small size, the deformation measurement of the MEMS relay is very difficult on a macroscopic scale. The digital image correlation technology was employed to determine the dimensions and displacements of the moving relay. Based on the video films and the collapse deformation of the structure, the pull-in voltages were obtained that represent the instability characteristic of the micro-system. Meanwhile, by combining the tools of finite element method and boundary element method, the instability behavior of the MEMS relays was numerically simulated with an electronic-mechanical coupling analysis. The simulation results obtained by this hybrid computation of combining FEM and BEM are in good agreement with the experimental ones.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Cong-Shun Wang, Weibin Zhang, Chunyang Xiong, and Jing Fang "Experiment and simulation study of instability of a novel electrostatic MEMS relay", Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); https://doi.org/10.1117/12.468762
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KEYWORDS
Relays

Microelectromechanical systems

Finite element methods

Computer simulations

Digital image correlation

Electrodes

Actuators

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