Thermal deformation of electronic package using scanning moire method with high-resolution microscopy

Anand Krishna Asundi; Huimin Xie; Chai Gin Boay

doi:10.1117/12.468790

29 May 2002 Thermal deformation of electronic package using scanning moire method with high-resolution microscopy

Anand Krishna Asundi, Huimin Xie, Chai Gin Boay

Proceedings Volume 4537, Third International Conference on Experimental Mechanics; (2002) https://doi.org/10.1117/12.468790
Event: Third International Conference on Experimental Mechanics, 2002, Beijing, China

Abstract

In this paper, the electron bema moire method and AFM scanning moire method are proposed to measure the thermal deformation in the BGA electronic packages. Electron beam moire and AFM moire fringe patterns in the BGA package are recorded. The shear strain at different solders in the package is measured. The two measurement techniques are discussed and analyzed in detail. The adaptability of these two methods is compared.

Citation Download Citation

Anand Krishna Asundi, Huimin Xie, and Chai Gin Boay "Thermal deformation of electronic package using scanning moire method with high-resolution microscopy", Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); https://doi.org/10.1117/12.468790

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