Orthogonal method for processing of SU-8 resist in UV-LIGA

Jingquan Liu; Jun Zhu; Guipu Ding; Xiaolin Zhao; Bingchu Cai

doi:10.1117/12.442980

28 September 2001 Orthogonal method for processing of SU-8 resist in UV-LIGA

Jingquan Liu, Jun Zhu, Guipu Ding, Xiaolin Zhao, Bingchu Cai

Proceedings Volume 4557, Micromachining and Microfabrication Process Technology VII; (2001) https://doi.org/10.1117/12.442980
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States

Abstract

SU-8 is a negative, epoxy type, near-UV photoresist. The resist has been specifically developed for ultrathick, high-aspect-ratio MEMS-type applications. It has been proven to be very sensitive to process variations. In this paper, the orthogonal method is used in the process. While three processing parameters are used as control factors, experiments are performed and results are evaluated. As the results being analyzed, a proposed fabrication process is derived from optimizing the control factors. The output structure has straight sidewall profile, fine line and space resolution, and strong adhesion to substrate. The aspect ratio can be greater than 20 in the 200-um-thick resist. Furthermore, several metallic films are used as the substrates. The titanium film with oxidation treatment is found to have the stronger adhesion to the resist. The result will open possibilities for low-cost LIGA-type process for MEMS applications.

Citation Download Citation

Jingquan Liu, Jun Zhu, Guipu Ding, Xiaolin Zhao, and Bingchu Cai "Orthogonal method for processing of SU-8 resist in UV-LIGA", Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); https://doi.org/10.1117/12.442980

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