Integrated tool for fabrication of electronic components by laser direct write

Scott A. Mathews; Chengping Zhang; Todd Kegresse; David Liu

doi:10.1117/12.470644

18 June 2002 Integrated tool for fabrication of electronic components by laser direct write

Scott A. Mathews, Chengping Zhang, Todd Kegresse, David Liu

Proceedings Volume 4637, Photon Processing in Microelectronics and Photonics; (2002) https://doi.org/10.1117/12.470644
Event: High-Power Lasers and Applications, 2002, San Jose, California, United States

Abstract

A prototype workstation has been developed that allows the fabrication of passive electronic components at low temperatures using a laser direct-write process. The work station combines a variety of laser processing techniques onto a single, integrated platform. These techniques include material deposition, laser micromachining, laser sintering, and laser trimming. One particular process, referred to as 'mill and fill', combines the laser micromachining ability of the tool with 'off-the-shelf' conductor pastes to allow the fabrication of high density metalization at very low temperatures. The present work describes the details of the 'mill and fill' process and shows examples of prototype devices fabricated using this technique.

Citation Download Citation

Scott A. Mathews, Chengping Zhang, Todd Kegresse, and David Liu "Integrated tool for fabrication of electronic components by laser direct write", Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); https://doi.org/10.1117/12.470644

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