Ultra-thick lithography for advanced packaging and MEMS

Chad Brubaker; Rafiqul Islam; Helge Luesebrink

doi:10.1117/12.474225

24 July 2002 Ultra-thick lithography for advanced packaging and MEMS

Chad Brubaker, Rafiqul Islam, Helge Luesebrink

Proceedings Volume 4690, Advances in Resist Technology and Processing XIX; (2002) https://doi.org/10.1117/12.474225
Event: SPIE's 27th Annual International Symposium on Microlithography, 2002, Santa Clara, California, United States

Abstract

An ever increasing need exists for thick resist layers in the processing of MEMS and for advanced packaging. Applications in the MEMS field include bulk micromachining, surface micromachining, and the actual creating of active device structures. For advanced packaging, the applications are in redistribution and passivation layers, and micromolds for metal bumps. The various applications can require resist layer thicknesses up to and exceeding 1000 micrometers . In order to properly achieve these thicknesses, appropriate coating materials were developed by manufacturers. These materials include AZ P4620, Shipley SPR220, AZ PLP100XT, JSR THB 611P, and SU-8. Finally, equipment was developed to handle these materials, in the form of specialized coating equipment and contact/proximity aligners.

Citation Download Citation

Chad Brubaker, Rafiqul Islam, and Helge Luesebrink "Ultra-thick lithography for advanced packaging and MEMS", Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); https://doi.org/10.1117/12.474225

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