Wafer-level fault detection and classification on a photo track in a high volume fab

Timothy L. Jackson; Richard J. Markle; Clinton W. Miller; Edward C. Stewart; Robert A. Crowell

doi:10.1117/12.475649

12 July 2002 Wafer-level fault detection and classification on a photo track in a high volume fab

Timothy L. Jackson, Richard J. Markle, Clinton W. Miller, Edward C. Stewart, Robert A. Crowell

Proceedings Volume 4692, Design, Process Integration, and Characterization for Microelectronics; (2002) https://doi.org/10.1117/12.475649
Event: Design, Process Integration, and Characterization for Microelectronics, 2002, Santa Clara, CA, United States

Abstract

We will discuss Advanced Micro Devices's (AMD) Fault Detection and Classification (FDC) program strategy and our six-step project template that we have identified that must be addressed for any successful FDC effort. We will discuss the recent development and implementation of a wafer-level FDC system on a TEL CLEAN TRAC ACT 8 photo track system in AMD's Fab25, a high volume microprocessor factory. We will present our approach to designing and implementing this FDC system and demonstrate its ability to automatically identify specific wafers within a lot that require manual review. Upon manual review, the decision can be made to rework the specific wafers or the lot.

Citation Download Citation

Timothy L. Jackson, Richard J. Markle, Clinton W. Miller, Edward C. Stewart, and Robert A. Crowell "Wafer-level fault detection and classification on a photo track in a high volume fab", Proc. SPIE 4692, Design, Process Integration, and Characterization for Microelectronics, (12 July 2002); https://doi.org/10.1117/12.475649

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