Precision Alignment For X-Ray Lithography

J L Kreuzer; G P Hughes; C LaFiandra

doi:10.1117/12.942329

18 June 1984 Precision Alignment For X-Ray Lithography

J L Kreuzer, G P Hughes, C LaFiandra

Proceedings Volume 0471, Electron-Beam, X-Ray, and Ion-Beam Techniques for Submicrometer Lithographies III; (1984) https://doi.org/10.1117/12.942329
Event: 1984 Microlithography Conferences, 1984, Santa Clara, United States

Abstract

X-ray lithography promises cost-effective integrated circuit production with submicron resolution. Achievement of this promise requires precision mask-to-wafer alignment over the whole wafer. This paper describes Perkin-Elmer's X-100 full-field X-ray lithography system with emphasis on the alignment subsystem. The alignment subsystem provides six degrees of freedom alignment between wafer and mask with an air gauge gap setting technique and a laser based physical optics lateral alignment system. These techniques were selected to be compatible with the subfield-stepper systems needed to pattern wafers over 100 mm in diameter. The physical optics technique has demonstrated alignment stability with signal-to-noise ratios representing less than 0.01 micron rms error for a 30 Hz bandwidth. The alignment system and its relation to the entire lithographic system is described in detail. X-ray exposed alignment overlays are shown.

Citation Download Citation

J L Kreuzer, G P Hughes, and C LaFiandra "Precision Alignment For X-Ray Lithography", Proc. SPIE 0471, Electron-Beam, X-Ray, and Ion-Beam Techniques for Submicrometer Lithographies III, (18 June 1984); https://doi.org/10.1117/12.942329

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