Reliability of packaged MEMS in shock environment: crack and striction modeling

Olivier Millet; Dominique Collard; Lionel Buchaillot

doi:10.1117/12.462874

19 April 2002 Reliability of packaged MEMS in shock environment: crack and striction modeling

Olivier Millet, Dominique Collard, Lionel Buchaillot

Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462874
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France

Abstract

This paper aims at providing a detailed analysis of the consequences of shocking a packaged microstructure to a solid surface. Particularly it concerns the response of homogeneous, packaged clamped-clamped polysilicon microfabricated beams, which can be used in the case of MEMS switches. The theoretical analysis is composed of three parts; first, the micro-machined is considered as a single degree of freedom oscillator the motions of which is governed by an ordinary differential equation. It allows calculation of the deflection induced by the shock. Secondly, we determine the deflections inducing a stress of 1.5Gpa corresponding to the destruction of the polysilicon structures, for small and large deflections considerations. Finally, from the two first parts, pre-shock conditions (velocity and acceleration) are found to avoid stiction, impact and destruction of the packaged microstructures. It is shown that these pre-shock conditions depend on structural properties and damping. Moreover, a shock can generate decelerations ranging of millions of g's.

Citation Download Citation

Olivier Millet, Dominique Collard, and Lionel Buchaillot "Reliability of packaged MEMS in shock environment: crack and striction modeling", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); https://doi.org/10.1117/12.462874

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