Advances in light-curing adhesives: II. Solutions designed for automation

Andy Bachmann

doi:10.1117/12.482156

9 September 2002 Advances in light-curing adhesives: II. Solutions designed for automation

Andy Bachmann

Proceedings Volume 4771, Optomechanical Design and Engineering 2002; (2002) https://doi.org/10.1117/12.482156
Event: International Symposium on Optical Science and Technology, 2002, Seattle, WA, United States

Abstract

The promise of photonics is to provide the next affordable leap in communications and information technology. Low yields and high unit costs are a barrier to mass production. Assembling photonic components economically represents one of the most demanding manufacturing processes in industry today due to the challenges in yield, cycle time and material costs. Manually assembling photonic components will not support the industry's growth rate. Achieving the promise of long term success demands successful automation strategy. Understanding cycle time and throughput and focusing on yield will allow the development of the lowest cost, most successful assembly of photonic, as well as electronic, components.

Citation Download Citation

Andy Bachmann "Advances in light-curing adhesives: II. Solutions designed for automation", Proc. SPIE 4771, Optomechanical Design and Engineering 2002, (9 September 2002); https://doi.org/10.1117/12.482156

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