Development of a thermoconductive and vibration-protective interface for a linear cryogenic cooler

Alexander M. Veprik; Vladimir I. Babitsky; Sergey V. Riabzev; Nachman Pundak

doi:10.1117/12.452057

23 January 2003 Development of thermoconductive and vibration-protective interface for a linear cryogenic cooler

Alexander M. Veprik, Vladimir I. Babitsky, Sergey V. Riabzev, Nachman Pundak

Proceedings Volume 4820, Infrared Technology and Applications XXVIII; (2003) https://doi.org/10.1117/12.452057
Event: International Symposium on Optical Science and Technology, 2002, Seattle, WA, United States

Abstract

Modern electro-optic applications often contain a cryogenically cooled IR imager placed upon a stabilized platform which is connected to an outer housing by low-friction gimbals. Since the active system of gumball stabilization is dedicated primarily to maintaining the steady line-of-sight control by eliminating the relatively slow effects of yaw, pitch or roll, it may have insufficient resources to suppress an excessive high-frequency vibration exported from the internal active components such as the linear compressor of a cryogenic cooler. To reduce the above vibration export, the authores use an optimally stiffened and damped all-metal vibration isolator is combination with a tuned dynamic absorber. For effective heat sinking, a commercially available metallic plain bearing allowing the compressor to slide freely inside the above plain bearing, which is further thermally connected to the appropriate 'cold wall' of the device. The vibration protective and thermally conductive interface developed allows the use of a split Stirling cryocooler, relying on a highly efficient, cheap and durable linear single-piston compressor within the IR imager mounted upon the gimbaled stabilized platform.

Citation Download Citation

Alexander M. Veprik, Vladimir I. Babitsky, Sergey V. Riabzev, and Nachman Pundak "Development of thermoconductive and vibration-protective interface for a linear cryogenic cooler", Proc. SPIE 4820, Infrared Technology and Applications XXVIII, (23 January 2003); https://doi.org/10.1117/12.452057

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