Aerial-image-based inspection of binary (OPC) and embedded-attenuated PSM

Felix Chang; Chang-Cheng Hung; John C.H. Lin; Anja Rosenbusch; Reuven Falah; Shirley Hemar

doi:10.1117/12.467767

27 December 2002 Aerial image-based inspection of binary (OPC) and embedded-attenuated PSM

Felix Chang, Chang-Cheng Hung, John C.H. Lin, Anja Rosenbusch, Reuven Falah, Shirley Hemar

Proceedings Volume 4889, 22nd Annual BACUS Symposium on Photomask Technology; (2002) https://doi.org/10.1117/12.467767
Event: Photomask Technology 2002, 2002, Monterey, CA, United States

Abstract

The paper presents a revolutionary technology to inspect advanced contact layers. Instead of finding defects based on a size-dependent defect specification, defects are found according to their impact at the wafer CD result. The inspection methodology used is aerial imaging. The main advantage of this method is that only defects, which actually affect the wafer result, will be detected and classified. The paper presents first inspection results on contact layers designed for the 130nm and 90 nm technology node.

Citation Download Citation

Felix Chang, Chang-Cheng Hung, John C.H. Lin, Anja Rosenbusch, Reuven Falah, and Shirley Hemar "Aerial image-based inspection of binary (OPC) and embedded-attenuated PSM", Proc. SPIE 4889, 22nd Annual BACUS Symposium on Photomask Technology, (27 December 2002); https://doi.org/10.1117/12.467767

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