Cost-effective strategies for ASIC masks

Dipankar Pramanik; Henry H. Kamberian; Christopher J. Progler; Michael Sanie; David Pinto

doi:10.1117/12.485280

2 July 2003 Cost effective lithography approaches for ASIC circuits

Dipankar Pramanik, Henry H. Kamberian, Christopher J. Progler, Michael Sanie, David Pinto

Proceedings Volume 5043, Cost and Performance in Integrated Circuit Creation; (2003) https://doi.org/10.1117/12.485280
Event: Advanced Microelectronic Manufacturing, 2003, Santa Clara, CA, United States

Abstract

It is suggested that the high cost of mask sets for 90nm and below technologies may restrict the application of technologies to a handful of high volume chips. Most of the cost for mask production is a result of the increased time to write and inspect (including defect disposition) a mask due to the large files that are created prior to mask writing. Stringent mask specifications needed for low k factor imaging drive protracted and costly yield learning curves for a mask maker. The cost of different steps in the flow from design tape-out to final wafer test are analyzed and it is shown that limiting the reticle field size on critical layers could reduce net costs. The net die cost is lower as long as the number of processed wafers stays below a cutoff number. Costs can be further decreased by reducing the overall "figure count" (and hence writing time) for an ASIC chip by restricting the amount of OPC done on critical layers.

Citation Download Citation

Dipankar Pramanik, Henry H. Kamberian, Christopher J. Progler, Michael Sanie, and David Pinto "Cost effective lithography approaches for ASIC circuits", Proc. SPIE 5043, Cost and Performance in Integrated Circuit Creation, (2 July 2003); https://doi.org/10.1117/12.485280

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