Analysis of integrated chip of core pitch matching using microlens arrays

Wen-Ming Cheng; Hen-Wai Tsao; Shyh-Lin Tsao

doi:10.1117/12.505822

6 November 2003 Analysis of integrated chip of core pitch matching using microlens arrays

Wen-Ming Cheng, Hen-Wai Tsao, Shyh-Lin Tsao

Proceedings Volume 5174, Novel Optical Systems Design and Optimization VI; (2003) https://doi.org/10.1117/12.505822
Event: Optical Science and Technology, SPIE's 48th Annual Meeting, 2003, San Diego, California, United States

Abstract

In this paper, we design microlens arrays for the improvement of the optical power coupling efficiency of 8x8 planar lightwave circuit (PLC) devices. Eight fiber array input and output are considered for integrated packaging with 8x8 PLCs. A variety of core pitches matching are achieved from 25μm to 127μm between integrated optical chips and fiber array. We presented a simple formula, which is useful for microlens arrays design. Our proposed microlens arrays provide versatility in a micro-optics package for optical communication. Our results are helpful for low-cost packaging, monolithic integration optics modularization, and minimization of the optical power coupling loss between fiber array and array module.

Citation Download Citation

Wen-Ming Cheng, Hen-Wai Tsao, and Shyh-Lin Tsao "Analysis of integrated chip of core pitch matching using microlens arrays", Proc. SPIE 5174, Novel Optical Systems Design and Optimization VI, (6 November 2003); https://doi.org/10.1117/12.505822

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KEYWORDS

Microlens array

Photonic integrated circuits

Microlens

Integrated optics

Optical alignment

Channel projecting optics

Packaging

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