Paper
14 May 2004 Do we need complex resist models for predictive simulation of lithographic process performance?
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Abstract
This paper describes different simplified simulation models which characterize the behavior of the photoresist during lithography processes. The effectiveness of these models is compared with the results of more physics and chemistry containing simulators. The strengths and weaknesses of the simplified models are demonstrated for practical applications. Simplified resist model parameters are calibrated for 193nm chemically amplified resists (CAR). The results are compared with calibration of full simulation models. The validity of the simulation models under different process conditions is investigated.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bernd Tollkuhn, Andreas Erdmann, Jeroen Lammers, Christoph Nolscher, and Armin Semmler "Do we need complex resist models for predictive simulation of lithographic process performance?", Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); https://doi.org/10.1117/12.534045
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Cited by 8 scholarly publications and 5 patents.
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KEYWORDS
Finite element methods

Calibration

Data modeling

Photomasks

Diffusion

Optical proximity correction

Semiconducting wafers

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