Paper
21 July 2004 Damping of polycrystalline Ni-Mn-Ga, bulk, PLD, and sputtered thin film
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Abstract
Polycrystalline Ni-Mn-Ga in bulk, pulsed laser deposition (PLD) thin film, and radio frequency (RF) sputtered thin film are studied. A thin film of direct current (DC) magnetron sputter deposited NiTi was also used in the study. A polycrystalline Ni-Mn-Ga bulk sample was measured to have a tan δ = 0.4925 and a maximum elastic modulus E = 7.3 GPa. Material characterization studies were performed on polycrystalline Ni-Mn-Ga thin films deposited by PLD onto single crystal (100) Si and (100) MgO substrates at substrate temperatures ranging from 550°C to 650°C. Damping measurements on RF sputter deposition of 1 μm Ni-Mn-Ga and 10 μm of NiTi both on copper substrates were performed in cantilever beam ring down tests. Results show 1 μm RF sputter deposited Ni-Mn-Ga thin film on a 54 μm copper substrate improves damping properties.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David A. Ruggles, Eric Gans, Kotekar P. Mohanchandra, Gregory P. Carman, E. Ngo, W. Nothwang, and M. W. Cole "Damping of polycrystalline Ni-Mn-Ga, bulk, PLD, and sputtered thin film", Proc. SPIE 5387, Smart Structures and Materials 2004: Active Materials: Behavior and Mechanics, (21 July 2004); https://doi.org/10.1117/12.540185
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Cited by 6 scholarly publications.
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KEYWORDS
Thin films

Copper

Silicon

Crystals

Nickel

Sputter deposition

Thin film deposition

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