Disbond detection in adhesively bonded structures using piezoelectric wafer active sensors

Adrian Cuc; Victor Giurgiutiu

doi:10.1117/12.540358

21 July 2004 Disbond detection in adhesively bonded structures using piezoelectric wafer active sensors

Adrian Cuc, Victor Giurgiutiu

Proceedings Volume 5394, Health Monitoring and Smart Nondestructive Evaluation of Structural and Biological Systems III; (2004) https://doi.org/10.1117/12.540358
Event: NDE for Health Monitoring and Diagnostics, 2004, San Diego, CA, United States

Abstract

Adhesively bonded joints between metallic and composite plates are gaining increasing acceptance in safety critical applications such as automotive and aerospace structures. Lamb wave methods have considerable potential for the inspection of adhesive joints and assemblies for two reasons: they do not require direct access to the bond region, and they are much more amenable to rapid scanning than are compression wave techniques. Lamb waves can be excited in one plate of a bonded assembly, propagated across the joint region, and received in the second plate of the assembly. The paper will present a study of the use of guided Lamb waves for disbond detection in adhesively bonded layered media using piezoelectric wafer active sensors (PWAS). The focus is on developing and compare methods for damage and disbond detection in adhesively bonded structures. For far-field detection, propagating Lamb waves will be used in pitch-catch and pulse-echo modes. The pitch-catch method will send Lamb waves across the adhesive joint, while the pulse-echo method will send Lamb waves along the joint line. For near-field detection, high-frequency standing Lamb waves will be used to evaluate the presence of disbond from the changes in the mechanical impedance of the bonded joint. The standing wave approach is achieved with the self-sensing electromechanical impedance method. Both, the propagating and the standing Lamb waves are generated with the same PWAS installation. The combination of far-field and near-field damage detection in the same sensor installation is a unique feature of our work.

Citation Download Citation

Adrian Cuc and Victor Giurgiutiu "Disbond detection in adhesively bonded structures using piezoelectric wafer active sensors", Proc. SPIE 5394, Health Monitoring and Smart Nondestructive Evaluation of Structural and Biological Systems III, (21 July 2004); https://doi.org/10.1117/12.540358

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available