Bottom-emitting flip-chip VCSEL structure with reduced constraints on modulation response

Ahmad N. Al-Omari; Stewart A. Feld; Kevin L. Lear

doi:10.1117/12.558041

4 November 2004 Bottom-emitting flip-chip VCSEL structure with reduced constraints on modulation response

Ahmad N. Al-Omari, Stewart A. Feld, Kevin L. Lear

Proceedings Volume 5556, Photonic Devices and Algorithms for Computing VI; (2004) https://doi.org/10.1117/12.558041
Event: Optical Science and Technology, the SPIE 49th Annual Meeting, 2004, Denver, Colorado, United States

Abstract

Intrinsic and extrinsic limitations on conventional top-emitting high-speed VCSEL modulation bandwidth are discussed. A new VCSEL structure has been designed with reduced constraints on modulation bandwidth. The structure simultaneously addresses the primary extrinsic factors that limit the VCSEL modulation bandwidth. The new bottom-emitting, flip-chipped VCSEL structure improves heat-sinking, current injection uniformity, and reduces parasitic capacitance. We estimate the ultimate bandwidth of this new structure to be as high as 40Gb/s.

Citation Download Citation

Ahmad N. Al-Omari, Stewart A. Feld, and Kevin L. Lear "Bottom-emitting flip-chip VCSEL structure with reduced constraints on modulation response", Proc. SPIE 5556, Photonic Devices and Algorithms for Computing VI, (4 November 2004); https://doi.org/10.1117/12.558041

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available