High-precision high-speed separation of semiconductor substrates

Jeffrey Patrick Sercel

doi:10.1117/12.597773

12 April 2005 High-precision high-speed separation of semiconductor substrates

Jeffrey Patrick Sercel

Proceedings Volume 5713, Photon Processing in Microelectronics and Photonics IV; (2005) https://doi.org/10.1117/12.597773
Event: Lasers and Applications in Science and Engineering, 2005, San Jose, California, United States

Abstract

Scribing with ultra-violet (UV) lasers has emerged as an alternative method of scribing semiconductor wafers for separation, particularly for thin silicon and germanium wafers, as well as other brittle compound semiconductor wafers materials such as GaP and GaAs.

Citation Download Citation

Jeffrey Patrick Sercel "High-precision high-speed separation of semiconductor substrates", Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); https://doi.org/10.1117/12.597773

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