From CD to 3D sidewall roughness analysis with 3D CD-AFM

Johann Foucher

doi:10.1117/12.599229

10 May 2005 From CD to 3D sidewall roughness analysis with 3D CD-AFM

Johann Foucher

Proceedings Volume 5752, Metrology, Inspection, and Process Control for Microlithography XIX; (2005) https://doi.org/10.1117/12.599229
Event: Microlithography 2005, 2005, San Jose, California, United States

Abstract

The continuous shrink of device's dimensions has reached such level that parameters such as line edge and line width roughness (LER and LWR) become non negligible for advance process development. Therefore, it is now mandatory to work with 3D metrology techniques in order to fulfil roadmap requirements. The goal of this paper is to show the potentiality of the CD-AFM as a real predictable 3D metrology in order to accelerate advance devices development by understanding and solving the strong limitations at a certain point of each technological steps (lithography, front-end etching...). Line edge and line width roughness are part of this future 3D metrology.

Citation Download Citation

Johann Foucher "From CD to 3D sidewall roughness analysis with 3D CD-AFM", Proc. SPIE 5752, Metrology, Inspection, and Process Control for Microlithography XIX, (10 May 2005); https://doi.org/10.1117/12.599229

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