Metrology of deep trench etched memory structures using 3D scatterometry

Peter Reinig; Rene Dost; Manfred Moert; Thomas Hingst; Ulrich Mantz; Jasen Moffitt; Sushil Shakya; Christopher J. Raymond; Mike Littau

doi:10.1117/12.599342

10 May 2005 Metrology of deep trench etched memory structures using 3D scatterometry

Peter Reinig, Rene Dost, Manfred Moert, Thomas Hingst, Ulrich Mantz, Jasen Moffitt, Sushil Shakya, Christopher J. Raymond, Mike Littau

Author Affiliations +

Proceedings Volume 5752, Metrology, Inspection, and Process Control for Microlithography XIX; (2005) https://doi.org/10.1117/12.599342
Event: Microlithography 2005, 2005, San Jose, California, United States

Abstract

Scatterometry is receiving considerable attention as an emerging optical metrology in the silicon industry. One area of progress in deploying these powerful measurements in process control is performing measurements on real device structures, as opposed to limiting scatterometry measurements to periodic structures, such as line-space gratings, placed in the wafer scribe. In this work we will discuss applications of 3D scatterometry to the measurement of advanced trench memory devices. This is a challenging and complex scatterometry application that requires exceptionally high-performance computational abilities. In order to represent the physical device, the relatively tall structures require a high number of slices in the rigorous coupled wave analysis (RCWA) theoretical model. This is complicated further by the presence of an amorphous silicon hard mask on the surface, which is highly sensitive to reflectance scattering and therefore needs to be modeled in detail. The overall structure is comprised of several layers, with the trenches presenting a complex bow-shape sidewall that must be measured. Finally, the double periodicity in the structures demands significantly greater computational capabilities. Our results demonstrate that angular scatterometry is sensitive to the key parameters of interest. The influence of further model parameters and parameter cross correlations have to be carefully taken into account. Profile results obtained by non-library optimization methods compare favorably with cross-section SEM images. Generating a model library suitable for process control, which is preferred for precision, presents numerical throughput challenges. Details will be discussed regarding library generation approaches and strategies for reducing the numerical overhead. Scatterometry and SEM results will be compared, leading to conclusions about the feasibility of this advanced application.

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Peter Reinig, Rene Dost, Manfred Moert, Thomas Hingst, Ulrich Mantz, Jasen Moffitt, Sushil Shakya, Christopher J. Raymond, and Mike Littau "Metrology of deep trench etched memory structures using 3D scatterometry", Proc. SPIE 5752, Metrology, Inspection, and Process Control for Microlithography XIX, (10 May 2005); https://doi.org/10.1117/12.599342

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