Organosiloxane based bottom antireflective coating for 193nm lithography

Bo Li; Kim Do; Jason Stuck; Songyuan Xie; Roger Leung; Tiffany Nguyen; Jaswinder Gill; Lei Jin; Wenya Fan; Shilpa Thanawala; Faith Zhou; Nancy Iwamoto; Emma Brouk; Joseph Kennedy

doi:10.1117/12.600015

4 May 2005 Organosiloxane based bottom antireflective coating for 193nm lithography

Bo Li, Kim Do, Jason Stuck, Songyuan Xie, Roger Leung, Tiffany Nguyen, Jaswinder Gill, Lei Jin, Wenya Fan, Shilpa Thanawala, Faith Zhou, Nancy Iwamoto, Emma Brouk, Joseph Kennedy

Author Affiliations +

Proceedings Volume 5753, Advances in Resist Technology and Processing XXII; (2005) https://doi.org/10.1117/12.600015
Event: Microlithography 2005, 2005, San Jose, California, United States

Abstract

A spin-on sacrificial 193 nm UV absorbing organosiloxane film was developed to facilitate ArF photoresist (PR) patterning. To improve lithographic compatibility with acrylate based photoresists, different performance additives were evaluated as photoresist adhesion promoter. The results suggested that the type and loading of the photoresist adhesion promoter had a large impact on the profile and focus latitude of the patterned photoresist features. An efficient photoresist adhesion promoter candidate was identified, which has minimum impact on other solution and film properties. This work has led to the development of DUO 193 organosiloxane based bottom anti-reflective coating. Application of this film as a blanket level bottom anti-reflective coating or as a fill material for via first trench last (VFTL) dual damascene patterning is possible. The SiO structure intrinsic to this film provides a high degree of plasma etch selectivity to the thin ArF photoresists in use today. Furthermore, an equivalent plasma etch rate between DUO 193 and the low dielectric constant SiOCH films used as the dielectric layer in the backend Cu interconnect structure is possible without compromising the photoresist etch selectivity. Equivalent etch rate is necessary for complete elimination of the “fencing” or “shell” defects found at the base of the etched trench feature located at the perimeter of the top of the via. Advanced ArF PR features of 100 nm in width (and smaller) have been routinely patterned on DUO 193 film. Via fill, plasma etch rate, wet etch rate, ArF PR patterning and shelf life data will be discussed in this presentation.

Citation Download Citation

Bo Li, Kim Do, Jason Stuck, Songyuan Xie, Roger Leung, Tiffany Nguyen, Jaswinder Gill, Lei Jin, Wenya Fan, Shilpa Thanawala, Faith Zhou, Nancy Iwamoto, Emma Brouk, and Joseph Kennedy "Organosiloxane based bottom antireflective coating for 193nm lithography", Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005); https://doi.org/10.1117/12.600015

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available