The Application Of Holospeckle-Shearing Interferometry To Displacement And Slope Analysis Of A Diaphragm Used In Silicon Pressure Sensors

Liu Rongxun; Fang Jing; Wei Xiangyu; Qin Jichang; Shi Xiaodong

doi:10.1117/12.952375

16 July 1986 The Application Of Holospeckle-Shearing Interferometry To Displacement And Slope Analysis Of A Diaphragm Used In Silicon Pressure Sensors

Liu Rongxun, Fang Jing, Wei Xiangyu, Qin Jichang, Shi Xiaodong

Author Affiliations +

Proceedings Volume 0599, Optics in Engineering Measurement; (1986) https://doi.org/10.1117/12.952375
Event: 1985 International Technical Symposium/Europe, 1985, Cannes, France

Abstract

A new technique combining holographic and speckle-shearing interferometry is applied. Using the technique, the displacement and the slope of diaphragms of the silicon pressure sensor have been measured separately from a single holospeckle-shearinggram. The experimental results are in good agreement with theoretical analysis.

Citation Download Citation

Liu Rongxun, Fang Jing, Wei Xiangyu, Qin Jichang, and Shi Xiaodong "The Application Of Holospeckle-Shearing Interferometry To Displacement And Slope Analysis Of A Diaphragm Used In Silicon Pressure Sensors", Proc. SPIE 0599, Optics in Engineering Measurement, (16 July 1986); https://doi.org/10.1117/12.952375

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