Paper
2 December 2005 Microwave packaging for 10-Gb/s EML modulators
Yu Liu, Liang Xie, Haiqing Yuan, Jiabao Zhang, Ninghua Zhu, Changzheng Sun, Bing Xiong, Yi Luo
Author Affiliations +
Proceedings Volume 6020, Optoelectronic Materials and Devices for Optical Communications; 60201O (2005) https://doi.org/10.1117/12.636469
Event: Asia-Pacific Optical Communications, 2005, Shanghai, China
Abstract
A novel microwave packaging technique for 10Gb/s electro-absorption modulator integrated with distributed feedback laser (EML) is presented. The packaging parasitics and intrinsic parasitics are both well considered, and the packaging circuit was synthetically designed to compensate for the intrinsic parasitic of the chip. A butterfly-packaged EML module has been successfully developed to prove that. The small-signal modulation bandwidth of the butterfly-packaged module is about 10 GHz. Optical fiber transmission experiments have shown that the module can be used for 10Gb/s optical transmission system. After transmission through 40km, the power penalty is less than 1 dBm at a bit-error-rate of 10-12.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yu Liu, Liang Xie, Haiqing Yuan, Jiabao Zhang, Ninghua Zhu, Changzheng Sun, Bing Xiong, and Yi Luo "Microwave packaging for 10-Gb/s EML modulators", Proc. SPIE 6020, Optoelectronic Materials and Devices for Optical Communications, 60201O (2 December 2005); https://doi.org/10.1117/12.636469
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KEYWORDS
Packaging

Modulators

Microwave radiation

Optoelectronic devices

Modulation

Connectors

Semiconductor lasers

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