Paper
15 March 2006 A dive into clear water: immersion defect capabilities
B. Streefkerk, J. Mulkens, R. Moerman, M. Stavenga, J. van der Hoeven, C. Grouwstra, R. Bruls, M. Leenders, S. Wang, Y. van Dommelen, M. Boerema, H. Jansen, K. Cummings, M. Riepen, H. Boom, M. Suddendorf, P. Huisman
Author Affiliations +
Abstract
This paper discusses the types and formation of immersion defects. It is shown that drying stains and water marks are the main immersion defects. The immersion defects are related to resist leaching, water penetration and droplet formation. It is shown that scanner immersion hood design based on an actuated air gap and air curtain droplet clean-up minimizes defect counts. Additionally, pre-and post soaks steps in the track can reduce drying stains and water marks. The defect performance is evaluated on XT:1250i and XT:1400i systems. It is shown that the immersion defect density can go as low as 0.01 /cm2, which is well below the ITRS 2005 number of 0.03 /cm2.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
B. Streefkerk, J. Mulkens, R. Moerman, M. Stavenga, J. van der Hoeven, C. Grouwstra, R. Bruls, M. Leenders, S. Wang, Y. van Dommelen, M. Boerema, H. Jansen, K. Cummings, M. Riepen, H. Boom, M. Suddendorf, and P. Huisman "A dive into clear water: immersion defect capabilities", Proc. SPIE 6154, Optical Microlithography XIX, 61540S (15 March 2006); https://doi.org/10.1117/12.660376
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Cited by 6 scholarly publications.
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KEYWORDS
Particles

Thin film coatings

Semiconducting wafers

Scanners

Curtains

Photoresist processing

Scanning electron microscopy

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