Thermally induced stresses resulting from coefficient of thermal expansion differentials between an LED sub-mount material and various mounting substrates

Charles DeMilo; Corey Bergad; Ronald Forni; Thomas Brukilacchio

doi:10.1117/12.697489

13 February 2007 Thermally induced stresses resulting from coefficient of thermal expansion differentials between an LED sub-mount material and various mounting substrates

Charles DeMilo, Corey Bergad, Ronald Forni, Thomas Brukilacchio

Author Affiliations +

Proceedings Volume 6486, Light-Emitting Diodes: Research, Manufacturing, and Applications XI; 64860N (2007) https://doi.org/10.1117/12.697489
Event: Integrated Optoelectronic Devices 2007, 2007, San Jose, California, United States

Abstract

A study has been conducted to determine the effects of mechanical stresses induced from the coefficient of thermal expansion (CTE) differential between a light emitting diode (LED) chip, and various substrate materials to which the LEDs were mounted. The LEDs were bonded to typical packaging materials including ceramics, copper and metal matrix composites. The objective of this investigation was to determine the viability of implementing alternate substrate materials for packaging of LED power chips. In particular, thermally induced stresses resulting from the CTE differentials between the alternate substrate materials and the LED sub-mount material were analyzed and compared against the stresses resulting from the nearly ideal CTE match that is realized with traditional ceramic substrates.

Citation Download Citation

Charles DeMilo, Corey Bergad, Ronald Forni, and Thomas Brukilacchio "Thermally induced stresses resulting from coefficient of thermal expansion differentials between an LED sub-mount material and various mounting substrates", Proc. SPIE 6486, Light-Emitting Diodes: Research, Manufacturing, and Applications XI, 64860N (13 February 2007); https://doi.org/10.1117/12.697489

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