Investigation of optimized wafer sampling with multiple integrated metrology modules within photolithography equipment

Ted L. Taylor; Eri Makimura

doi:10.1117/12.711572

5 April 2007 Investigation of optimized wafer sampling with multiple integrated metrology modules within photolithography equipment

Ted L. Taylor, Eri Makimura

Author Affiliations +

Proceedings Volume 6518, Metrology, Inspection, and Process Control for Microlithography XXI; 651822 (2007) https://doi.org/10.1117/12.711572
Event: SPIE Advanced Lithography, 2007, San Jose, California, United States

Abstract

Micron Technology, Inc., explores the challenges of defining specific wafer sampling scenarios for users of multiple integrated metrology modules within a Tokyo Electron Limited (TEL) CLEAN TRACK^TM LITHIUS^TM. With the introduction of integrated metrology (IM) into the photolithography coater/developer, users are faced with the challenge of determining what type of data is required to collect to adequately monitor the photolithography tools and the manufacturing process. Photolithography coaters/developers have a metrology block that is capable of integrating three metrology modules into the standard wafer flow. Taking into account the complexity of multiple metrology modules and varying across-wafer sampling plans per metrology module, users must optimize the module wafer sampling to obtain their desired goals. Users must also understand the complexity of the coater/developer handling systems to deliver wafers to each module. Coater/developer systems typically process wafers sequentially through each module to ensure consistent processing. In these systems, the first wafer must process through a module before the next wafer can process through a module, and the first wafer must return to the cassette before the second wafer can return to the cassette. IM modules within this type of system can reduce throughput and limit flexible wafer selections. Finally, users must have the ability to select specific wafer samplings for each IM module. This case study explores how to optimize wafer sampling plans and how to identify limitations with the complexity of multiple integrated modules to ensure maximum metrology throughput without impact to the productivity of processing wafers through the photolithography cell (litho cell).

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Ted L. Taylor and Eri Makimura "Investigation of optimized wafer sampling with multiple integrated metrology modules within photolithography equipment", Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 651822 (5 April 2007); https://doi.org/10.1117/12.711572

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KEYWORDS

Semiconducting wafers

Metrology

Optical lithography

Manufacturing

Software development

Lithium

Inspection

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