Paper
3 March 2008 Thermal microscope imaging system for semiconductor device and IC invalidation analysis
Author Affiliations +
Proceedings Volume 6621, International Symposium on Photoelectronic Detection and Imaging 2007: Photoelectronic Imaging and Detection; 662117 (2008) https://doi.org/10.1117/12.790776
Event: International Symposium on Photoelectronic Detection and Imaging: Technology and Applications 2007, 2007, Beijing, China
Abstract
In order to analyze the invalidation of the Semiconductor Device and IC, we proposed a novel digital thermal microscope based on the uncooled focal plane detector. We give the operating principle, system's construction and the mathematical mode of noise equivalent temperature difference (NETD). Based on the mathematical model, some measures were taken to increase the system temperature resolution. Furthermore we proposed an adaptive nonuniformity correction algorithm for the UFPA. The software for the thermal microscope is provided based on Visual C++. Results of real thermal image experiments have shown that the digital thermal microscope is designed successfully and achieves good performance. Thus it will become an effective means for invalidation Analysis. This method is a novel and unique contribution to field of semiconductor device and IC invalidation analysis.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Meijing Gao, Weiqi Jin, Yinan Chen, and Xia Wang "Thermal microscope imaging system for semiconductor device and IC invalidation analysis", Proc. SPIE 6621, International Symposium on Photoelectronic Detection and Imaging 2007: Photoelectronic Imaging and Detection, 662117 (3 March 2008); https://doi.org/10.1117/12.790776
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KEYWORDS
Microscopes

Thermography

Infrared radiation

Infrared imaging

Semiconductors

Imaging systems

Nonuniformity corrections

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