Thermal analysis of wafer-level LED packages with multichips

Jae-Wan Choi; Jeung-Mo Kang; Jae-Wook Kim; Jeong-Hyeon Choi; Du-Hyun Kim; Geun-Ho Kim; Yong-Seon Song; Yu-Ho Won; Jeong-Soo Lee

doi:10.1117/12.758825

26 September 2007 Thermal analysis of wafer-level LED packages with multichips

Jae-Wan Choi, Jeung-Mo Kang, Jae-Wook Kim, Jeong-Hyeon Choi, Du-Hyun Kim, Geun-Ho Kim, Yong-Seon Song, Yu-Ho Won, Jeong-Soo Lee

Author Affiliations +

Proceedings Volume 6797, Manufacturing LEDs for Lighting and Displays; 67970R (2007) https://doi.org/10.1117/12.758825
Event: Manufacturing LEDs for Lighting and Display, 2007, Berlin, Germany

Abstract

Thermal analysis of wafer-level packaged LEDs with red, green and blue multi-chips are investigated. With Si-MEMS technology, wafer-level packaged LEDs are useful for the high power applications such as back light unit (BLU) and general solid state lighting due to the compactness and integrated fabrication process. In this paper, thermal characteristics of wafer-level packaged white LEDs with multi-chips are investigated using both serial and matrix measurement methods.

Citation Download Citation

Jae-Wan Choi, Jeung-Mo Kang, Jae-Wook Kim, Jeong-Hyeon Choi, Du-Hyun Kim, Geun-Ho Kim, Yong-Seon Song, Yu-Ho Won, and Jeong-Soo Lee "Thermal analysis of wafer-level LED packages with multichips", Proc. SPIE 6797, Manufacturing LEDs for Lighting and Displays, 67970R (26 September 2007); https://doi.org/10.1117/12.758825

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