Paper
7 January 2008 The design of a new concavity heat sink for the high power semiconductor laser array
Hong-Dong Zhao, Mei Sun, Hong-Li Tian, Jin-Qin Wang
Author Affiliations +
Abstract
In this paper, we will present the new structure of the concavity heat sink with flower water in the pipe for semiconductor laser array. In the CW operation, the main equations of controlling temperature and boundary conditions are described in the concavity heat sink. The static thermal conduction equation that govern heat flow in the high power laser array and the heat sink is given. The variational equation integral of equation has been described according the boundary conditions based on Finite Element Method. The process of solving the equation is included and the distribution of temperature in the concavity heat sink is studied. The virtues of concavity heat sink comparing with the rectangle heat sink are showed. We also design the thickness of the concavity heat sink. The difference of the concavity heat sink and the rectangle heat sink will be presented. The result shows that the maximum temperature in the heat sink and the temperature grads especially in the corner of heat sink are dropped and this heat sink is best fit for the heat leaving off the laser array.
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Hong-Dong Zhao, Mei Sun, Hong-Li Tian, and Jin-Qin Wang "The design of a new concavity heat sink for the high power semiconductor laser array", Proc. SPIE 6824, Semiconductor Lasers and Applications III, 68241C (7 January 2008); https://doi.org/10.1117/12.756649
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KEYWORDS
High power lasers

Semiconductor lasers

Finite element methods

Continuous wave operation

Interfaces

Technetium

High power fiber amplifiers

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