Optical performance of bare image sensor die and sensors packaged at the wafer level and protected by a cover glass

G. Humpston; A. Grinman; O. Jackl; M. Ebel

doi:10.1117/12.764716

3 March 2008 Optical performance of bare image sensor die and sensors packaged at the wafer level and protected by a cover glass

G. Humpston, A. Grinman, O. Jackl, M. Ebel

Author Affiliations +

Proceedings Volume 6897, Optoelectronic Integrated Circuits X; 68970U (2008) https://doi.org/10.1117/12.764716
Event: Integrated Optoelectronic Devices 2008, 2008, San Jose, California, United States

Abstract

The yield of solid state camera modules declines with increasing imager resolution. The easiest means of compensating for this trend is to package the imager die before they are assembled into camera modules. The packaging is preferably accomplished at the wafer level. The package cover is a sheet of glass that forms part of the optical train of the solid state camera. This paper discusses the properties required of the glass and describes a computer model that was constructed to provide quantitative insight into its effect on the optical performance of image sensors. The study corroborates practical measurements that the cover glass has no significant effect on the low light sensitivity of a typical camera module. The cover glass does introduce some reflection losses and minor image aberrations, but these can be managed through the combination of attention to the design of the total optical path and making the cover glass as thin as possible.

Citation Download Citation

G. Humpston, A. Grinman, O. Jackl, and M. Ebel "Optical performance of bare image sensor die and sensors packaged at the wafer level and protected by a cover glass", Proc. SPIE 6897, Optoelectronic Integrated Circuits X, 68970U (3 March 2008); https://doi.org/10.1117/12.764716

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