Canon's development status of EUVL technologies

Shigeyuki Uzawa; Hiroyoshi Kubo; Yoshinori Miwa; Toshihiko Tsuji; Hideki Morishima; Kazuhiko Kajiyama; Takayuki Hasegawa

doi:10.1117/12.769894

26 March 2008 Canon's development status of EUVL technologies

Shigeyuki Uzawa, Hiroyoshi Kubo, Yoshinori Miwa, Toshihiko Tsuji, Hideki Morishima, Kazuhiko Kajiyama, Takayuki Hasegawa

Author Affiliations +

Proceedings Volume 6921, Emerging Lithographic Technologies XII; 69210N (2008) https://doi.org/10.1117/12.769894
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

We developed a small field exposure tool (SFET) in collaboration with EUVA (Extreme Ultraviolet Lithography System Development Association). SFET was installed at SELETE (Semiconductor Leading Edge Technologies; Japanese Consortium) in 2006. SFET is positioned as a cornerstone of the manufacturing technologies for EUVL Full- Field tools as well as tool for resist and mask development. We started the system design of the Full-Field tool and fabrication of the six-mirror projection optics based on the experience of the SFET. In this paper, we introduce the outline of Canon's activities for the full-field tool. EUVL is requested to resolve the sub 30 nm features. The studies of the resolution for higher NA EUV projection optics is also presented.

Citation Download Citation

Shigeyuki Uzawa, Hiroyoshi Kubo, Yoshinori Miwa, Toshihiko Tsuji, Hideki Morishima, Kazuhiko Kajiyama, and Takayuki Hasegawa "Canon's development status of EUVL technologies", Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69210N (26 March 2008); https://doi.org/10.1117/12.769894

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