The measurement uncertainty challenge for the future technological nodes production and development

J. Foucher; P. Faurie; A.-L. Foucher; M. Cordeau; V. Farys

doi:10.1117/12.812446

23 March 2009 The measurement uncertainty challenge for the future technological nodes production and development

J. Foucher, P. Faurie, A.-L. Foucher, M. Cordeau, V. Farys

Proceedings Volume 7272, Metrology, Inspection, and Process Control for Microlithography XXIII; 72721K (2009) https://doi.org/10.1117/12.812446
Event: SPIE Advanced Lithography, 2009, San Jose, California, United States

Abstract

With the continuous shrinkage of dimensions in the semiconductor industry, the measurement uncertainty is becoming one of the major component that have to be controlled in order to guarantee sufficient production yield for the next technological nodes production. Thus, CD-SEM and Scatterometry techniques have to face new challenges in term of accuracy and subsequently new challenges in measurement uncertainty that were not really taken into account at the origin of their introduction in production. In this paper, we will present and discuss results about the accuracy requirements related to key applications for advanced technological nodes production. Thus, we will present results related to OPC model precision improvement by using suitable reference metrology model based on the 3D-AFM technique use. An interesting study related to 193 resist shrinkage during CD-SEM measurement will be also presented and therefore the impact on measurement uncertainty will be discussed. Finally we will conclude this paper by showing the potential industrial benefits to use a simple but relevant 3D-AFM reference metrology model use into the semiconductor production environment.

Citation Download Citation

J. Foucher, P. Faurie, A.-L. Foucher, M. Cordeau, and V. Farys "The measurement uncertainty challenge for the future technological nodes production and development", Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 72721K (23 March 2009); https://doi.org/10.1117/12.812446

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