Effects of stress on the adhesive behavior of photoresist

Geng Yu; Zhang Wei; Changlun Hou; Jian Bai

doi:10.1117/12.832073

18 May 2009 Effects of stress on the adhesive behavior of photoresist

Geng Yu, Zhang Wei, Changlun Hou, Jian Bai

Proceedings Volume 7284, 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems; 72840F (2009) https://doi.org/10.1117/12.832073
Event: AOMATT 2008 - 4th International Symposium on Advanced Optical Manufacturing, 2008, Chengdu, Chengdu, China

Abstract

In this paper, the effects of stress on the adhesive behavior of photoresist are described. The sources of internal stress of photoresist could be the shrinkage of photoresist during curing process and the shrinkage difference between the photoresist and the substrate. Due to high exothermicity of resin curing process, the temperature of photoresist is not uniform, which causes shrinkage difference in photoresist. Further more, when the substrate cools down, the difference of thermal expansion coefficients between the substrate and the photoresist would cause more stress. A digital phase-shifting interferometer is used to measure the curvature of substrate and then Stoney´s Formula is adopted to calculate stress. Then, a 2-D model is used to simulate temperature distribution, photoresist deformation and stress. Our results show that there is huge stress at the interface between photoresist and substrate and the stress can be reduced by anneal.

Citation Download Citation

Geng Yu, Zhang Wei, Changlun Hou, and Jian Bai "Effects of stress on the adhesive behavior of photoresist", Proc. SPIE 7284, 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 72840F (18 May 2009); https://doi.org/10.1117/12.832073

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KEYWORDS

Photoresist materials

Adhesives

Temperature metrology

Interfaces

Etching

Wet etching

Computer simulations

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