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This paper presents a new pose measurement method of microminiature parts that is capable of transforming one
dimension (1D) contour size obtained by optical micrometer to three dimension (3D) data with six parameters for
microassembly. Pose measurement is one of the most important processes for microminiature parts' alignment and
insertion in microassembly. During the past few years, researchers have developed their microassembly systems focusing
on visual identification to obtain two or three dimension data with no more than three parameters. Scanning electronic
microscope (SEM), optical microscope, and stereomicroscope are applied in their systems. However, as structures of
microminiature parts become increasingly complex, six parameters to represent their position and orientation are
specifically needed. Firstly, The pose measurement model is established based on the introduction of measuring objects
and measuring principle of optical micrometer. The measuring objects are microminiature parts with complex 3D
structure. Two groups of two dimension (2D) data are gathered at two different measurement positions. Then part pose
with 6 parameters is calculated, including 3 position parameters of feature point of the part and 3 orientation parameters
of the part axis. Secondly, pose measurement process for a small shaft, vertical orientation determination, and position
parameters obtaining are presented. 2D data is gathered by scanning the generatrix of the part, and valid data is extracted
and saved in arrays. A vertical orientation criterion is proposed to determine whether the part is parallel to the Z-axis of
the coordinate. If not, 2D data will be fixed into a linear equation using least square algorithm. Then orientation
parameters are calculated. Center of Part End (CPE) is selected as feature point of the part, and its position parameters
are extracted form two group of 2D data. Finally, a fast pose measurement device is developed and representative
experiments are carried out. Results show that the measurement method could obtain pose of complex 3D micro parts
fast and accurately, and can meet the demand of microassembly system.
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