Paper
20 March 2010 Study of practical TAT reduction approaches for EUV flare correction
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Abstract
We introduce techniques of flare compensation for Extreme Ultraviolet Lithography that can reduce the calculation time of a flare map and flare correction. In the first approach, the range of a flare point spread function is divided into several regions and the size of meshes for the flare map in each region is selected. In the second approach, the size of the mask pattern is controlled by referring to the flare map in the mask-making process. In the third approach, dosage of each point in a mask corresponding to the flare map is modulated when transferring the mask pattern onto the resist. Use of these approaches in the proper combination is effective for TAT reduction and accuracy of the flare compensation.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ryoichi Inanami, Hiromitsu Mashita, Takamasa Takaki, Toshiya Kotani, Suigen Kyoh, and Satoshi Tanaka "Study of practical TAT reduction approaches for EUV flare correction", Proc. SPIE 7636, Extreme Ultraviolet (EUV) Lithography, 763616 (20 March 2010); https://doi.org/10.1117/12.846326
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Cited by 3 scholarly publications and 1 patent.
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KEYWORDS
Photomasks

Semiconducting wafers

Extreme ultraviolet lithography

Point spread functions

Scattering

Critical dimension metrology

Convolution

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