Paper
2 April 2010 Model-based proximity effect correction for electron-beam direct-write lithography
Chun-Hung Liu, Pei-Lin Tien, Philip C. W. Ng, Yu-Tian Shen, Kuen-Yu Tsai
Author Affiliations +
Abstract
A model-based proximity effect correction methodology is proposed and tested for electron-beam-direct-write lithography. It iteratively modulates layout geometry by feedback compensation until the correction error converges. The energy intensity distribution is efficiently calculated by fast convolving the modulated layout with a point-spread function which models electron beam shape and proximity effects primarily due to electron scattering in resist. The effectiveness of this methodology is measured by iteration numbers required for meeting the patterning fidelity specifications. It is examined versus process parameters including acceleration voltage and resist thickness with several regular mask geometries and practical design layouts.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chun-Hung Liu, Pei-Lin Tien, Philip C. W. Ng, Yu-Tian Shen, and Kuen-Yu Tsai "Model-based proximity effect correction for electron-beam direct-write lithography", Proc. SPIE 7637, Alternative Lithographic Technologies II, 76371V (2 April 2010); https://doi.org/10.1117/12.846706
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Cited by 5 scholarly publications.
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KEYWORDS
Process modeling

Photoresist processing

Modulation

Scattering

Model-based design

Semiconducting wafers

Electron beam direct write lithography

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