Paper
29 March 2010 Point-of-use filtration methods to reduce defectivity
Author Affiliations +
Abstract
While immersion lithography has been rapidly implemented in manufacturing environments around the world, a few defect challenges still remain. Bubble and watermark defects are well understood and have been addressed by equipment manufacturers. However, a few defects still bewilder the lithography community, including residues and microbridging. These defects are difficult to completely eliminate as they may have many root causes. However, through effective point-of-use filtration, they can be greatly reduced. Point-of-use filtration has traditionally focused on selecting a filter membrane at a specific pore size that is compatible with the resist chemistry being utilized in the process. The research hereby discussed indicates that in addition to these important point-of-use filter choices, careful filtration parameter setup can improve defectivity results and impact the coating process.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jennifer Braggin, Wim Schoallert, Kenji Hoshiko, and Xavier Buch "Point-of-use filtration methods to reduce defectivity", Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 763918 (29 March 2010); https://doi.org/10.1117/12.846346
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KEYWORDS
Semiconducting wafers

Chemistry

Composites

Coating

Manufacturing

Particles

Photoresist processing

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