Paper
2 April 2010 Process sizing aware flow for yield calculation
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Abstract
Layout sizing in the mask preparation step is commonly used on critical layers to improve printing process windows. The current flow of yield calculation based on critical areas of a layout typically does not take into account this sizing step. In this paper, we propose a new and simple flow that accounts for the sizing to improve the accuracy of yield calculation. We compare the calculated results using the current and sizing-aware flow to demonstrate the differences. We also show that results from the sizing-aware flow better match the calculated circuit switching power, which already takes into account this sizing step.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chi-Min Yuan "Process sizing aware flow for yield calculation", Proc. SPIE 7641, Design for Manufacturability through Design-Process Integration IV, 76410E (2 April 2010); https://doi.org/10.1117/12.846607
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KEYWORDS
Yield improvement

Metals

Photomasks

Switching

Semiconducting wafers

Optical lithography

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