Application Specific Wafer Stepper

Dick Fallon; James R. Shih

doi:10.1117/12.967052

1 January 1987 Application Specific Wafer Stepper

Dick Fallon, James R. Shih

Proceedings Volume 0772, Optical Microlithography VI; (1987) https://doi.org/10.1117/12.967052
Event: Microlithography Conferences, 1987, Santa Clara, CA, United States

Abstract

Overlay, throughput and lens performance are three critical parameters of optical alignment equipment. High overlay accuracy will give high die yields for alignment sensitive parts or can allow designers to use tighter design rules which will allow a shrink of the chip and more chips per wafer. This work contains high overlay accuracy data obtained during the processing of production wafer lots of a 64K HRAM (Hierarchical RAM) device using an ASM Lithography PAS 2000 Wafer Stepper.

Citation Download Citation

Dick Fallon and James R. Shih "Application Specific Wafer Stepper", Proc. SPIE 0772, Optical Microlithography VI, (1 January 1987); https://doi.org/10.1117/12.967052

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