Applying the dynamical model of drying process of a polymer solution coated on a flat substrate to effects of bumpy substrate

Hiroyuki Kagami; Hiroshi Kubota

doi:10.1117/12.860485

27 August 2010 Applying the dynamical model of drying process of a polymer solution coated on a flat substrate to effects of bumpy substrate

Hiroyuki Kagami, Hiroshi Kubota

Author Affiliations +

Proceedings Volume 7764, Nanoengineering: Fabrication, Properties, Optics, and Devices VII; 77640T (2010) https://doi.org/10.1117/12.860485
Event: SPIE NanoScience + Engineering, 2010, San Diego, California, United States

Abstract

We apply the former general dynamical model of drying process of polymer solution coated on a flat substrate for flat polymer film fabrication to concrete detailed subjects. Concretely we apply the model to effects of a bumpy substrate as an example. We understand that a humpy structure on a substrate does not affect nearly solute's distribution after drying because effects of diffusion around the hump are sufficiently effective as far as the hump interfere with diffusion. We also understand that when the beginning time of special vaporization near a hump is earlier, solute's distribution after drying except for at the edge's region is thinner a little because leveling including the edge's region by diffusion is more effective.

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Hiroyuki Kagami and Hiroshi Kubota "Applying the dynamical model of drying process of a polymer solution coated on a flat substrate to effects of bumpy substrate", Proc. SPIE 7764, Nanoengineering: Fabrication, Properties, Optics, and Devices VII, 77640T (27 August 2010); https://doi.org/10.1117/12.860485

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