Crack growth and reliability modeling of multi-layer capacitors in microelectronics applications

Gilad Sharon; Donald Barker

doi:10.1117/12.871536

18 February 2011 Crack growth and reliability modeling of multi-layer capacitors in microelectronics applications

Gilad Sharon, Donald Barker

Proceedings Volume 7928, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X; 79280D (2011) https://doi.org/10.1117/12.871536
Event: SPIE MOEMS-MEMS, 2011, San Francisco, California, United States

Abstract

Factors affecting the reliability of the ceramic dielectric body of multi layer ceramic capacitors (MLCCs) were explored for several capacitor sizes. Preliminary results indicate a correlation between the materials used for capacitor termination and the emergence of cracks. The authors varied the termination material, shape, and thickness of MLCCs. Under regimes in which boards were subjected to cyclic bending, vibrations, temperature cycling, and high-g loading, cracks have tended to appear on the bottom of the capacitor in proximity to the termination. Flexible termination materials corresponded to reduced crack formation at low strain rates.

Citation Download Citation

Gilad Sharon and Donald Barker "Crack growth and reliability modeling of multi-layer capacitors in microelectronics applications", Proc. SPIE 7928, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X, 79280D (18 February 2011); https://doi.org/10.1117/12.871536

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