Impact of polymerization process on OOB on lithographic performance of a EUV resist

Vipul Jain; Suzanne M. Coley; Jung June Lee; Matthew D. Christianson; Daniel J. Arriola; Paul LaBeaume; Maria E. Danis; Nicolas Ortiz; Su-Jin Kang; Michael D. Wagner; Amy Kwok; David A. Valeri; James W. Thackeray

doi:10.1117/12.879487

7 April 2011 Impact of polymerization process on OOB on lithographic performance of a EUV resist

Vipul Jain, Suzanne M. Coley, Jung June Lee, Matthew D. Christianson, Daniel J. Arriola, Paul LaBeaume, Maria E. Danis, Nicolas Ortiz, Su-Jin Kang, Michael D. Wagner, Amy Kwok, David A. Valeri, James W. Thackeray

Author Affiliations +

Proceedings Volume 7969, Extreme Ultraviolet (EUV) Lithography II; 796912 (2011) https://doi.org/10.1117/12.879487
Event: SPIE Advanced Lithography, 2011, San Jose, California, United States

Abstract

Several approaches have been used to minimize LWR in advanced resists. Various polymer and matrix properties, such as polymer molecular volume and free volume fraction, polymer dissolution, impact of activation energy of the deprotection reaction and distribution of small molecules in the polymer matrix have been shown to influence the functional behavior of the resist. We have developed polymerization methods to improve the incorporation and homogeneity of monomers, including PAG monomer, in an EUV resist polymer. Further, we report on use of a new cation which imparts reduced OOB character and a 30% improvement in LWR for a 28nm L/S feature with sensitivity of 10mJ/cm2 versus a control containing the TPS cation. Additionally this new material is capable of 21nm resolution. We also tested the new cation for outgassing by RGA and observed a 60% reduction in outgassing versus a TPS control.

Citation Download Citation

Vipul Jain, Suzanne M. Coley, Jung June Lee, Matthew D. Christianson, Daniel J. Arriola, Paul LaBeaume, Maria E. Danis, Nicolas Ortiz, Su-Jin Kang, Michael D. Wagner, Amy Kwok, David A. Valeri, and James W. Thackeray "Impact of polymerization process on OOB on lithographic performance of a EUV resist", Proc. SPIE 7969, Extreme Ultraviolet (EUV) Lithography II, 796912 (7 April 2011); https://doi.org/10.1117/12.879487

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available