Potted fiber optic sensor coil by novel adhesives for high-stability FOG

Congzhi Bi; Guofei Sun; Yanji Wu; Keyong Zhao

doi:10.1117/12.898760

8 September 2011 Potted fiber optic sensor coil by novel adhesives for high-stability FOG

Congzhi Bi, Guofei Sun, Yanji Wu, Keyong Zhao

Proceedings Volume 8191, International Symposium on Photoelectronic Detection and Imaging 2011: Sensor and Micromachined Optical Device Technologies; 81910D (2011) https://doi.org/10.1117/12.898760
Event: International Symposium on Photoelectronic Detection and Imaging 2011, 2011, Beijing, China

Abstract

A sensor coil for a fiber optic gyroscope is fabricated and potted by a novel adhesive. The kind of adhesive can match to the outer jacket of polarization maintaining fiber (PMF) to improve the potting uniformity of the whole coil, so that it could contribute to reduce the temperature-induced strain and the strain differential between the clockwise and counterclockwise-wound portions of a symmetrically-wound fiber coil, i.e. temperature-dependent Shupe stress effect. The adhesive is a compound comprising acrylate and polyurethane, which can avoid the non-wetting problem resulting from the two different types of compounds. The adhesive is a low viscosity system which exhibits a prolonged work life, an adjustable hardness. Specially, the potting compound with a low glass transition temperature (Tg), down to the lower temperature -60°C, remain stable modulus during thermal cycling between -40°C and 60°C. The potted fiber optic sensor coil with a smooth surface is clear and regular due to the completely curable adhesive. The extinction coefficient of the fiber optic sensor coil can reflect the additional stress produced by the adhesives through comparing before potting with after potting. the potted fiber optic sensor coil shows excellent bias characteristics and temperature performance.

Citation Download Citation

Congzhi Bi, Guofei Sun, Yanji Wu, and Keyong Zhao "Potted fiber optic sensor coil by novel adhesives for high-stability FOG", Proc. SPIE 8191, International Symposium on Photoelectronic Detection and Imaging 2011: Sensor and Micromachined Optical Device Technologies, 81910D (8 September 2011); https://doi.org/10.1117/12.898760

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